Gerber viewer and DFM check

Preview ready. Rotate the board and go through the findings below. The files were read, but there are no layers to draw for a preview. These files could not be read. Use Gerber RS-274X or X2 files, Excellon drill files or a zip of them. No Gerber layers were found in these files. Not used in the preview: Remove Board thickness entered above {p} plated, {n} non-plated Nothing outside our standard capability was found in the checks that could run. Contact us On request Outside our standard capability – contact us. Fine in a panel – contact us if it must run as a single board. Available on request – contact us. Estimated from the spacing of the paste pads – please confirm. Found from the package names, and the paste-pad spacing (an estimate) points the same way. Parts: {refs}. Packages: {pkgs}. Board or panel larger than our line takes The board or panel is {w} × {h} mm. Our line takes {minw} × {minh} mm to {maxw} × {maxh} mm; larger sizes by arrangement. Board smaller than the line minimum The board is {w} × {h} mm and the line minimum is {minw} × {minh} mm. Small boards are normally assembled in a panel – try the panelization preview. Board thickness outside our standard range The board is {t} mm thick; our standard range is {tmin}–{tmax} mm. Passives smaller than 01005 Chip size {code} found. Our standard is down to 0201, with 01005 on request. 01005 passives Chip size {code} found. Our standard is down to 0201; 01005 is placed on request. QFP/QFN pitch below 0.4 mm A pitch of {min} mm found. Our standard QFP/QFN pitch is down to 0.4 mm. BGA pitch below 0.4 mm A BGA pitch of {min} mm found. Our standard is down to 0.5 mm, with 0.4 mm on request. BGA pitch below 0.5 mm A BGA pitch of {min} mm found. Our standard is down to 0.5 mm; 0.4 mm is on request. board thickness (no .gbrjob job file – enter the thickness above) package sizes and pitches by name (no BOM or pick-and-place file) Reading your files… Preparing the 3D view… Your browser cannot show 3D here, so this is a flat preview. {file}: the zip could not be opened for the preview. {file}: rar and 7z archives are not previewed – they are sent as they are. The measured size looks unusual – please check it. Some component positions fall outside the board – the origin of the pick-and-place file may differ. Board size Copper layers Drill holes Components BOM measured from the outline estimated from the copper layers from the job file {n} holes, {t} sizes, smallest Ø {d} mm {n} slots {n} placements: {top} top, {bottom} bottom Looks like: {list} {n} lines, {p} parts Layers and files found 3D preview of your circuit board Your pick-and-place file looks like a panel of {k} boards ({k} × {n} parts). We show one board below. Your Gerbers are a panel of {nx} × {ny} boards (panel {pw} × {ph} mm, board {bw} × {bh} mm). panel: {v} {n} boards ({nx} × {ny}) Panel Must fix Check Info Must be fixed before production May increase cost or lead time Does not prevent manufacturing Show on board Shown on the board: {name} No problems found in the checks that could run. Not checked with these files: top bottom Top copper Bottom copper Inner copper Top solder mask Bottom solder mask Top silkscreen Bottom silkscreen Top paste Bottom paste Board outline Drill, plated Drill, non-plated Drawing Job file BOM Pick-and-place (duplicate, not used) stencil checks (no paste layer) copper checks (no copper layer) drill checks (no drill file) placement checks (no pick-and-place file) BOM checks (no BOM) board size (no outline) tab placement and V-scoring of round boards (needs the panel plan) the checks could not be run on these files Board or panel too large The board or panel is {w} × {h} mm – larger than our line maximum of {maxw} × {maxh} mm. The board or panel does not fit the printer table / mounter conveyor and cannot be produced on this line. Smaller than the line minimum The board or panel is {w} × {h} mm – smaller than the line minimum of {minw} × {minh} mm, so it is run in a panel. Below the conveyor minimum the board cannot be transported reliably; boards jam or drop between rails. Tracks too narrow Tracks as narrow as {min} mm; the minimum is {rule} mm. Tracks below the minimum etch width can be etched away or open-circuit, causing broken nets and scrapped boards. Copper close to the edge Copper only {min} mm from the board edge; keep at least {rule} mm. Copper too close to the edge is torn during depaneling and can short or corrode at the exposed board edge. Mouse bites through copper Mouse-bite holes of the breakaway tabs run through copper. Mouse-bite perforations through copper tear the foil during depaneling, leaving burrs and exposed metal. Holes too small Holes as small as {min} mm; the smallest drill is {rule} mm. Holes below the minimum drill size break drill bits; the fab drills them oversize or skips them, risking open vias. Holes close to the edge Hole edges only {min} mm from the board edge; keep at least {rule} mm. Holes too close to the board edge can break out during routing, leaving damaged edges and exposed barrels. Narrow annular rings Copper rings around plated holes as narrow as {min} mm; at least {rule} mm is recommended. A narrow copper ring can break out when the hole is drilled slightly off-centre – the connection to the hole may be lost. Small stencil openings Stencil openings down to {min} mm; the minimum is {rule} mm with an area ratio of at least {ratio}. Small or low area-ratio stencil apertures release paste poorly, causing insufficient solder and open joints. Large paste openings Paste openings up to {max} mm; openings over {rule} mm should be split into a window pane. A single large paste aperture on a thermal pad deposits too much paste – the component floats or tilts in reflow and voids form under the pad. Paste layer missing Solder mask openings but no paste layer on: {sides}. Pads without paste apertures receive no solder in printing – those components will not be soldered. Open vias in pads Vias up to {rule} mm sit inside solder pads without plugging. Open vias inside paste apertures wick solder away from the joint, causing voids, weak fillets and tombstoning. Components close to the edge Components only {min} mm from the board edge; keep {rule}–5 mm clear. Components too close to the panel edge collide with the conveyor rails and clamps of the printer and mounter. Components near breakaway tabs Components within {rule} mm of a breakaway tab. Components near breakaway tabs take mechanical stress during depaneling – cracked MLCCs and broken solder joints. Thin board A {t} mm board is thin; it needs a panel with rails to stay flat. Thin boards flex during squeegee stroke and placement, causing paste smears and placement offsets. Too few fiducials Fiducials on the panel: {n}; the placement machine needs at least {rule}. Without enough fiducials the vision system cannot correct panel offset and rotation – every placement is skewed. Narrow panel rails The panel rails are {w} mm; the conveyor clamps need at least {rule} mm. Rails narrower than the clamp minimum cannot be gripped by the conveyor – the panel vibrates or drops. Narrow routing gap The routing gap between boards is {w} mm; at least {rule} mm is recommended. A routing channel narrower than the router bit cannot be cut; the panel outline will not match the data. Narrow breakaway tabs Breakaway tabs about {min} mm wide; at least {rule} mm is recommended. Narrow tabs break during handling and transport, releasing boards inside the machines. V-scoring would suit better Rectangular boards separate more cleanly with V-scoring at 0 mm spacing. Routed tabs cost more and leave rough edges on rectangular boards; v-scoring depanels cleaner and faster. Too few tooling holes Tooling holes on the panel: {n}; {rule} holes of {min}–{max} mm in the rails are recommended. Without tooling holes the printer jig cannot register the panel precisely - print offset between panels. Tooling hole size Tooling holes of {d} mm; {rmin}–{rmax} mm is recommended. Tooling pins need the specified hole diameter; wrong size holes seat loosely or not at all. Placements outside the board Placements outside the board outline: {n}. Placements outside the board cannot be assembled; usually the pick-and-place file has a different origin or belongs to another revision. BOM lines without part number BOM lines without a manufacturer part number: {n}. We have to identify these parts from the value and footprint – this may increase cost or lead time. Parts not fitted (DNP) BOM lines marked not to be fitted: {n}. Parts marked DNP are not fitted. Check that this is intended. In the BOM but not placed Designators in the BOM but not in the pick-and-place file ({n}): {refs} Without a position these parts cannot be placed by machine – they would be fitted by hand or left out. Placed but not in the BOM Placements not in the BOM ({n}): {refs} Positions without a BOM line have no part to place – usually fiducials or test points, otherwise a missing BOM line. Quantity differs from designators BOM lines whose quantity differs from the number of designators: {n}. We cannot tell which is right – the quantity or the designators – so we will ask before ordering parts.