Yamaha YCP10
Prints solder paste through a laser-cut stencil onto the board before placement.
- Board size 50 × 50 mm to 510 × 460 mm
- Positioning repeatability ±0.010 mm (6σ)
- Cycle time 8 s, excluding printing
Equipment and capabilities
One SMT line in Vaasa builds both prototypes and series, with inspection, coating, rework and test under the same roof.
In short: Comtec Labs assembles printed circuit boards in Vaasa, Finland, on one SMT line that runs both prototypes and series: a Yamaha YCP10 stencil printer, a Yamaha YSM10 high-speed placement machine and a convection reflow oven, followed by wave soldering, AOI on every board and X-ray on area-array packages. UV conformal coating, BGA and QFN rework, programming and functional test are done in the same ESD-protected building.
Machines on the line
Figures for the Yamaha machines are the manufacturer’s published datasheet values under optimum conditions. Other machines are listed by type.
Yamaha YSM10
Picks components from reels and trays and places them on the printed paste, with camera recognition of every part.
- Components from 03015 metric chips (0.3 × 0.15 mm) up to 55 × 100 mm and 15 mm high
- Up to 46,000 components per hour with the 10-nozzle head
- Placement accuracy ±0.035 mm (Cpk ≥ 1.0)
- Board size 50 × 50 mm to 510 × 460 mm; up to 96 component types on fixed feeders
Convection reflow oven
Melts the solder paste with controlled temperature profiles. Lead-free (RoHS) profiles are standard; a leaded process is available on request.
Wave soldering machine
Solders through-hole (THT) components. Parts that need it are soldered selectively by hand by certified operators.
Automated optical inspection (AOI)
Checks every assembled board for missing, shifted or reversed parts, bridges and insufficient solder.
X-ray inspection
Looks under BGA, QFN and other area-array packages for voids, bridges and opens that a camera cannot see.
UV conformal coating line
Applies HumiSeal UV50LV by selective spray only where the programme says, cures it with UV light and checks the coverage under UV light.
BGA and QFN rework station
Removes and replaces area-array and bottom-terminated parts, including reballing, to IPC-7711/7721.
Functional test and programming
Test benches built to your test specification and fixtures, and programming of microcontrollers and FPGAs on the line. Test instruments are calibrated annually.
ESD and moisture-sensitive device storage
ESD-protected work areas and storage, dry storage for moisture-sensitive devices and baking when their floor life has run out.
Assembly capabilities
| Area | Capability |
|---|---|
| Smallest package | Passives down to 0201, 01005 on request |
| Fine pitch | QFP and QFN down to 0.4 mm pitch |
| BGA | Down to 0.5 mm pitch, 0.4 mm on request; X-ray inspected |
| Board size | 50 × 50 mm to 330 × 250 mm on the line, larger by arrangement |
| Board thickness | 0.4–3.2 mm |
| Sides | Single- and double-sided reflow |
| Mixed technology | SMT and THT on the same board: reflow, then wave soldering or selective hand soldering |
| Solder process | Lead-free and RoHS-compliant as standard, leaded on request; REACH and RoHS declarations on request |
| Conformal coating | HumiSeal UV50LV, selective spray, UV cure, UV-light inspection of coverage |
| Inspection | AOI on every board, X-ray on BGA, QFN and other area-array packages; IPC-A-610 class 2 as standard, class 3 on request |
| Test | Functional test in-house to your specification; flying-probe and in-circuit test through partners on request |
| Bare boards | Made by vetted partner fabricators in Europe and Asia; up to 12 layers, HDI and controlled impedance |
| Components | Bought from franchised distributors, or fully or partly supplied by you with incoming inspection and MSD handling included |
Capacity
Prototypes and series run on the same SMT line, so the process proven on the prototype is the one that builds the series, and moving to series needs no new qualification.
There is no minimum order: you can start from one board. Small series of up to 500 boards and recurring series with call-off and scheduled deliveries run on the same line.
Quality, ESD and moisture-sensitive devices
- Workmanship to IPC-A-610 class 2 as standard and class 3 on request; repairs to IPC-7711/7721, logged per board.
- ESD-protected work areas and storage throughout production.
- Moisture-sensitive devices are kept in dry storage with floor-life records and baked when needed, also when you supply the parts.
- Every reel is registered at incoming inspection, feeders are verified against the BOM, and AOI and test results are stored per board.
- Components come from franchised distributors; a part available only on the open market is bought only with your written approval and inspected on arrival.
- Workmanship carries a 24-month warranty; repaired work carries a 12-month warranty.
Lead times
Typical times, counted from a complete kit with all components in house. We confirm the date for each order in the quote.
| Work | Typical time |
|---|---|
| Quote with DFM review | usually the same working day, at most 1 working day |
| Prototype assembly | 3–5 working days; express 48 h on request |
| Small series, up to 500 boards | 1–2 weeks |
| Series | 2–3 weeks; call-off and scheduled deliveries possible |
| Component sourcing | plus procurement time, typically 1–2 weeks for stock parts, confirmed per BOM in the quote |
| Conformal coating | plus 1 working day |
| Repair | assessment within 1 working day; a typical repair 2–5 working days |
| PCB design | layout typically 2–4 weeks depending on complexity; design review or DFM check 1–2 working days |
Services built on this equipment
- PCB assembly
- PCB prototype assembly
- PCB series and low-volume production
- PCB functional testing
- Conformal coating service
- PCB repair and rework
- Electronic component sourcing
- PCB design services
Request a quote
Send your Gerber or ODB++ files, BOM, pick-and-place file and quantities. You get prices, our DFM findings and a confirmed delivery date, usually the same working day and at most within 1 working day.
Ready for your next project?